Semiconductor Engineering: HBM Takes On A Much Bigger Role

by Madelyn Miller, On May 13, 2021

Michael Frank, Fellow and System Architect at Arteris IP is quoted in this new article in Semiconductor Engineering:

HBM Takes On A Much Bigger Role

May 13th, 2021 – By Brian Bailey

High-bandwidth memory may be a significant gateway technology that allows the industry to make a controlled transition to true 3D design and assembly.


“The benefit of HBM is really its high bandwidth,” says Michael Frank, fellow and system architect at Arteris IP. “If you have a working data set that fits, it’s fine. To consume that much bandwidth, you are likely to use a decent amount of silicon area to process it. But HBM does not providing the low latency that you get from SRAMs. You have to look at your application. What is your algorithm? In many systems, you sequentially process a lot of data, mostly with the same kind of processing scheme. It’s like SIMD or streaming. Machine learning is typically something like this, where you have large data sets and weights. But HBM is still limited in capacity, and the price is relatively high.”

To read the entire SemiEngineering article, please click here:

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