Beijing Nufront Selects Arteris FlexNoC Interconnect IP and C2C for Mobile Phone Systems on Chip (SoC)

by Arteris Marketing, On Jan 10, 2012

SUNNYVALE, California — January 10, 2012 — Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that its FlexNoC® interconnect IP has been licensed by Beijing Nufront, one of China’s fastest growing and most innovative systems and silicon providers.

Nufront logo

“Reaching timing convergence is so much easier with FlexNoC because it reduces back-end wire routing congestion and timing closure issues.”

Rock Yang, Vice President of Marketing, Nufront

After evaluating many technologies, Nufront chose Arteris’ network on chip interconnect IP to address the low power and high performance needs of its mobile phone systems on chip (SoC).

In addition to Arteris FlexNoC, Nufront chose the C2C™ Chip-to-Chip Link IP to allow low latency connections between SoCs. As announced on 26 July 2011, C2C is the first instance of an industry standard allowing shared memory between two chips, such as a mobile phone applications processor and a mobile phone modem. The 100ns round-trip latency of the C2C connection is fast enough for the modem to share the application processor’s RAM and to maintain enough read throughput and low latency for cache refills. This enables the phone manufacturer to remove the modem’s dedicated RAM chip from the phone’s bill of materials (BOM), saving a minimum $2 in cost per phone.

“Nufront is pushing the technical envelope to deliver the best mobile phone battery life while delivering maximum performance,” said Rock Yang, vice president of marketing at Nufront. “We know using Arteris FlexNoC interconnect IP will simultaneously lower our SoCs’ power consumption and increase our performance and frequency. Reaching timing convergence is so much easier with FlexNoC because it reduces back-end wire routing congestion and timing closure issues.”

Arteris network-on-chip interconnect IP is unique because it offers the ability to reduce the number of interconnect wires and logic required for SoC design. Reducing the interconnect wires and logic gates resolves routing congestion and timing closure issues at the back-end place-and-route stage, resulting in shorter development cycle time, faster SoC frequencies, smaller SoC area and less SoC power.

“Nufront’s selection of Arteris FlexNoC for such a critical part of their rapidly growing business shows the confidence SoC makers have in Arteris network on chip technology,” said K. Charles Janac, President and CEO of Arteris. “Arteris’ network-on-chip interconnect IP is a key enabler to creating modern mobile phone SoCs.”

About Arteris

Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs.

Founded by networking experts and offering the first commercially available Network-on-Chip IP products, Arteris operates globally with headquarters in Sunnyvale, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech. More information can be found at

Arteris, FlexNoC and the Arteris logo are trademarks of Arteris. All other product or service names are the property of their respective owners.