Rambus to Integrate Arteris FlexNoC IP in Future Development Initiatives
byOn Oct 14, 2014
By incorporating Arteris FlexNoC interconnect IP into our development programs, we are able to streamline our overall design time. This solution also provides us with flexibility to create derivations of our offerings to quickly adapt to changing market needs.
Mike Uhler, Vice President, Emerging Solutions Division, Rambus
“By incorporating Arteris FlexNoC interconnect IP into our development programs, we are able to streamline our overall design time,” said Mike Uhler, Vice President of the Emerging Solutions Division at Rambus. “This solution also provides us with flexibility to create derivations of our offerings to quickly adapt to changing market needs.”
“Having an innovative company like Rambus as a customer and partner is an honor,” said K. Charles Janac, President and CEO of Arteris. “We are excited to be a key enabling technology in future Rambus products.”
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as Samsung, Altera, and Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at www.arteris.com.
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