Arteris FlexNoC Resilience Package IP Licensed by STMicroelectronics
byOn Oct 06, 2016
Functional safety and data protection features enable more complex SoCs that can meet stringent ISO 26262 standards
CAMPBELL, Calif. — Oct. 4, 2016 — Arteris Inc., the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that STMicroelectronics has licensed Arteris FlexNoC interconnect IP along with the FlexNoC Resilience Package.
…we are finding that hardware data protection within the interconnect is increasingly required to meet our desired ISO 26262 ASIL levels. In our never-ending efforts to improve efficiency, we’ve found Arteris technology is helping us meet our safety and time-to-market goals.
Fabio Marchio, Vice President, Automotive and Discrete Group, STMicroelectronics
“As our SoCs continue to become more and more complex with a growing number of IP blocks and larger resulting on-chip interconnects, we are finding that hardware data protection within the interconnect is increasingly required to meet our desired ISO 26262 ASIL levels,” said Fabio Marchio, Automotive and Discrete Group Vice President of STMicroelectronics. “In our never-ending efforts to improve efficiency, we’ve found Arteris technology is helping us meet our safety and time-to-market goals.”
ISO 26262 automotive safety integrity levels (ASIL) are classifications used to help define the requirements necessary for a system to be compliant with the ISO 26262 Functional Safety for Road Vehicles standard. The lowest ASIL is QM, meaning “Quality Management”, and denotes the need for no special safety measures, while the highest safety level, ASIL D, represents the safety level for systems where malfunction could lead to fatal life-threatening injury. The Arteris FlexNoC Resilience Package can be used to create SoCs that meet ISO 26262 ASIL D requirements. Arteris is a member of the U.S. Technical Advisory Group (TAG) to the ISO 26262 TC22/SC32/WG08 working group, helping create safety standards for semiconductors and semiconductor IP.
“We are proud that ST has chosen Arteris interconnect IP technology as the backbone for use in the next generation of automotive SoCs,” said K. Charles Janac, President and CEO of Arteris. “We look forward to working with ST to implement interconnect technologies such as resilience to meet automotive functional safety requirements.”
Arteris, Inc. provides system-on-chip (SoC) interconnect IP and tools to accelerate SoC semiconductor assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as Samsung, Huawei / Hisilicon, Mobileye, Altera, and Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at www.arteris.com.
Arteris, FlexNoC and the Arteris logo are trademarks of Arteris. All other product or service names are the property of their respective owners.