Arteris provides Network on Chip (NoC) interconnect IP to improve performance, power consumption and die size of system on chip (SoC) devices for consumer electronics, mobile, automotive and other applications.
Using Arteris solves pain for our customers. Traditional bus and crossbar interconnect approaches create serious problems for architects, digital and physical designers, and integrators: Massive numbers of wires, increased heat and power consumption, failed timing closure, spaghetti-like routing congestion leading to increased die area, and difficulty making changes for derivatives.
Whether you are using AXI, OCP, AHB or a proprietary protocol, Arteris Network on Chip (NoC) IP reduces the number of wires by nearly one half, resulting in fewer gates and a more compact chip floor plan. Having the option to configure each connection’s width, and each transaction’s dynamic priority, assures meeting latency and bandwidth requirements. And with the Arteris IP configuration tool suite, design and verification can be done easily, in a matter of days or even hours.
Arteris invented Network on Chip technology, offering the world’s first commercial solution in 2006. Arteris connects the IP blocks in semiconductors from Qualcomm, Samsung, TI, and others, representing over 50 System on Chip devices. Find out more about Arteris products.
Network on Chip (NoC)
IP Products
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- FlexNoC
The ideal interconnect for System on Chip (SoC) designs requiring higher performance. - C2C™ Chip to Chip Link™ IP
DRAM memory sharing for application processors and modems. Save $2 in eBOM cost. - FlexLLI™ MIPI LLI Digital Controller IP
The only silicon-proven MIPI LLI implementation for DRAM memory sharing and companion chips. Save $2 in eBOM cost. - FlexWay
For design teams wanting to upgrade simpler SoCs from an AHB multilayer bus.
Samsung uses Arteris network-on-chip interconnect technology in its mobile phone applications processors and modems to easily connect them, shortening development cycles and reducing IP compatibility risks.
News & Events
» see all- 9 May 2012
iC-Logic Licenses Arteris FlexNoC and C2C Interconnect IP for Automotive Systems on Chip - 17 April 2012
Arteris FlexNoC Interconnect IP Licensed by Core Logic for Mobile and Multimedia Processors - 11 April 2012
MtekVision Licenses Arteris FlexLLI MIPI Low Latency Interface (LLI) IP - 28 March 2012
Arteris is EE Times ACE Awards finalist for Innovator of the Year - 8 March 2012
Carbon and Arteris Partner to Deliver Interconnect Models to SoC Designers - 29 February 2012
Arteris Unveils FlexLLI MIPI Alliance Low Latency Interface (MIPI LLI) IP to Reduce Mobile Phone Cost - 29 February 2012
Synopsys and Arteris Develop IP Solution to Reduce Mobile Phone Memory Costs - 23 February 2012
Interchip Connectivity: C2C, MIPI LLI and the path to 3D IC and TSV - 15 February 2012
Synopsys and Arteris Enable Earlier Multicore SoC Architecture Optimization with Faster Turnaround Times - 14 February 2012
Arteris President and CEO K. Charles Janac Named Finalist of the Prestigious UBM Electronics ACE Awards in the Innovator of the Year Category - 7 February 2012
Ingenic Licenses Arteris Chip-To-Chip (C2C) IP Solution for Mobile Application Processors






