Arteris provides Network on Chip (NoC) interconnect IP to improve performance, power consumption and die size of system on chip (SoC) devices for consumer electronics, mobile, automotive and other applications.
Using Arteris solves pain for our customers. Traditional bus and crossbar interconnect approaches create serious problems for architects, digital and physical designers, and integrators: Massive numbers of wires, increased heat and power consumption, failed timing closure, spaghetti-like routing congestion leading to increased die area, and difficulty making changes for derivatives.
Whether you are using AXI, OCP, AHB or a proprietary protocol, Arteris Network on Chip (NoC) IP reduces the number of wires by nearly one half, resulting in fewer gates and a more compact chip floor plan. Having the option to configure each connection’s width, and each transaction’s dynamic priority, assures meeting latency and bandwidth requirements. And with the Arteris IP configuration tool suite, design and verification can be done easily, in a matter of days or even hours.
Arteris invented Network on Chip technology, offering the world’s first commercial solution in 2006. Arteris connects the IP blocks in semiconductors from Qualcomm, Samsung, TI, and others, representing over 50 System on Chip devices. Find out more about Arteris products.
Network on Chip (NoC)» view all
The ideal interconnect for System on Chip (SoC) designs requiring higher performance.
- C2C™ Chip to Chip Link™ IP
DRAM memory sharing for application processors and modems. Save $2 in eBOM cost.
- FlexLLI™ MIPI LLI Digital Controller IP
The only silicon-proven MIPI LLI implementation for DRAM memory sharing and companion chips. Save $2 in eBOM cost.
For design teams wanting to upgrade simpler SoCs from an AHB multilayer bus.
Qualcomm® Incorporated has licensed Arteris Network on Chip (NoC) interconnect IP for use in its mobile wireless products.
Samsung uses Arteris network-on-chip interconnect technology in its mobile phone applications processors and modems to easily connect them, shortening development cycles and reducing IP compatibility risks.
Texas Instruments uses Arteris network-on-chip interconnect technology as the backbone SoC interconnect n its OMAP 4 and OMAP 5 platforms of mobile wireless applications processor products.
Toshiba has selected Arteris FlexNoC interconnect IP to enable faster design turnaround time for its next-generation SoCs.
News & Events» see all
- 17 April 2013
ARM and Arteris Extend Partnership to Deliver Additional Interconnect Options to SoC Designers
- 16 April 2013
Rockchip Leverages Arteris FlexNoC Interconnect IP for Next Generation SoCs
- 9 April 2013
K. Charles Janac of Arteris Selected by ExecRank Among Top Private Company CEOs for 2012
- 26 February 2013
Socle Technology Now Offers Arteris FlexNoC Platform
- 12 February 2013
Actions Semiconductor Licenses Arteris FlexNoC Interconnect IP for Multimedia Application Processors
- 29 January 2013
MegaChips Licenses Arteris FlexNoC Fabric IP for Next-Generation Imaging SoCs
- 22 January 2013
Open-Silicon Implements Arteris FlexNoC Interconnect IP in ARM Cortex-A9 ASIC
- 28 November 2012
Hogan NoC analysis - Sonics SGN, Arteris FlexNoC, ARM NIC 400: Setting the record straight
- 31 October 2012
Newly-Formed Japanese Joint Venture Licenses Arteris Chip-to-Chip (C2C) Interconnect IP
- 30 October 2012
Arteris FlexNoC Interconnect IP Licensed by Renesas Electronics Europe for Industrial Systems on Chip
- 16 October 2012
Arteris is 4th Fastest Growing Private Company in Silicon Valley