Network-on-chip interconnect IP data protection enables simpler ISO 26262 functional safety qualification while increasing SoC complexity and performance
CAMPBELL, Calif. — Sep. 20, 2016 — Arteris Inc., the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that Toshiba has licensed Arteris FlexNoC interconnect IP and the companion FlexNoC Resilience Package for use in its image recognition processors for ADAS applications.
The data protection technologies in the FlexNoC Resilience Package allow us to more easily implement state-of-the-art functional safety features in hardware, which simplifies the tasks of our software development teams as we strive to meet the most stringent ISO 26262 requirements.
Nobuaki Otsuka, Senior Manager, Mixed Signal IC Design Department, Toshiba
The Toshiba team chose Arteris FlexNoC as their on-chip interconnect IP after an exhaustive evaluation of nearly all the commercial crossbar- and NoC-based interconnects available on the market today. The evaluation quantified all aspects of the IP, not only performance metrics like bandwidth and latency but also ease of implementation, design flow integration, and support quality.
Toshiba’s image recognition processors are highly integrated systems, with many processing engines and image processing accelerators working in parallel. Arteris FlexNoC excelled due to its ability to optimally manage the high bandwidth and low latency quality of service (QoS) requirements for these near real-time systems. Implementing the features provided by the FlexNoC Resilience Package, such as error-correcting code (ECC) protection of on-chip communications and hardware duplication of interconnect components, helps the Toshiba design team more easily meet the diagnostic coverage requirements for the highest ISO 26262 automotive safety integrity levels (ASIL).
“As our ADAS image recognition processors have increased in complexity, we encountered limitations in older on-chip interconnect technologies,” said Nobuaki Otsuka, Senior Manager of Mixed Signal IC Design Department at Toshiba. “The Arteris network-on-chip technology scales much better, allowing us to increase the performance of our SoCs while reducing wire routing congestion and timing closure issues. The data protection technologies in the FlexNoC Resilience Package allow us to more easily implement state-of-the-art functional safety features in hardware, which simplifies the tasks of our software development teams as we strive to meet the most stringent ISO 26262 requirements.”
“We are honored that Toshiba has chosen Arteris technology as the interconnect backbone for their premier vision ADAS SoCs,” said K. Charles Janac, President and CEO of Arteris. “Toshiba’s choice is proof of Arteris interconnect IP’s ability to help designers of complex systems meet the strictest ISO 26262 functional safety requirements more simply and with less complexity than using software-only solutions.”
Arteris, Inc. provides system-on-chip (SoC) interconnect IP and tools to accelerate SoC semiconductor assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as Samsung, Huawei / Hisilicon, Mobileye, Altera, and Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at www.arteris.com.
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